GIGATEK INC.

Enabling World-Class Contract Manufacturing

We are equipped with state-of-the-art facilities and machinery for PCB assembly (Surface-mount technology (SMT), Plated-through hole (PTH), wave soldering, etc.), Dual-inline package (DIP) technology, 3D Computed Tomography, clean room design, plastic injection molding, silk screen printing, wire winding, Chip on Board (COB) assembly, etc.

In addition, we are committed to capital investment in order to maintain superior in-house manufacturing capabilities and to ensure cutting-edge service offerings.
For this reason, we acquired a state-of-the-art 3D X-Ray Machine in 2011 for 3D Computed Tomography (CT Ability), and constructed a brand new facility in Taichung in 2013.

Equipment Highlights：

Name	Brand	Model	Function	Q'ty	Capacity / Character
Screen Printer	TA CHEN	TC-3040	Solder Paste Printer	1	20 sec. / pc.
Auto Printe	DEK	ELAi	Solder Paste Printer	2	14 sec. / pc.
	DEK	Horizon 03i	Solder Paste Printer	2	12 sec. / pc.
	MINAMI	MK-868SV	Solder Paste Printer	1	25 sec. / pc.
	EKRA	X4	Solder Paste Printer	1	25 sec. / pc.
Glue Dispenser	SANYO	TDM-60	SMT Dispensing operations	1	15000 points / hr.
Chip Mounter	SONY	SI-F130	Placement speed 0.125 sec (0.3mm Pitch 01005)	1	154,000 point / hr.
		SI-E1000	Placement speed 0.28 sec (0402)	1
		SI-E1100	Placement speed 0.17 sec (0201)	3
	JUKI	KE-2070L	Placement speed 0.155 sec (0.3mm Pitch 01005)	2
Multi-Function Mounter	SONY	SI-F209	Placement speed 0.49 sec (0.3mmPitch)	2	7350 point / hr. (CHIP)
	SONY	SI-E2100	Placement speed 0.60 sec (0.3mm Pitch)	1	6000 point / hr. (CHIP)
	JUKI	KE-2060L	Placement speed 0.28 sec (0.4mm Pitch)	2	12,500 point / hr. (CHIP)
		KE-2070L+T	Placement speed 0.155 sec (0.3mm Pitch 01005)	1	18,580 point / hr. (CHIP)
		KE-2080L+T	Placement speed 0.155 sec (0.3mm Pitch 01005)	1	20,900 point / hr. (CHIP)
Hot Air Reflow Oven	Vitronics	XPM2 820A	Air Reflow	3	15's / Pcs
	Vitronics	MR933	N2 Reflow	2
	Loyal Sun	LS-16RN	N2 Reflow	1
Automatic Optical Inspection	TRi	TR7501DT	Automatic Inspection PCB	4
BGA REWORK STATION	DIC	RD-500SII	Rework BGA package Component	1
X-Ray 3D CT	GE	Micromex	2D，2.5D, CNC, CT	1	0.9um
X-ray Fluorescent Analyzer, XRF	SEIKO	SEA1000A	RoHS control substance quickly screening mechanism (Desk-Top)	1	Scope: Mg12 ~ U92