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TEL :+886-4-25375672
FAX :+886-4-25388836 |
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Enabling World-Class Contract Manufacturing
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Surface Mount |
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Optical Machine |
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3D X-Ray Machine |
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Test Equipment |
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We are equipped with state-of-the-art facilities and machinery for PCB assembly (Surface-mount technology (SMT), Plated-through hole (PTH), wave soldering, etc.), Dual-inline package (DIP) technology, 3D Computed Tomography, clean room design, plastic injection molding, silk screen printing, wire winding, Chip on Board (COB) assembly, etc.
In addition, we are committed to capital investment in order to maintain superior in-house manufacturing capabilities and to ensure cutting-edge service offerings.
For this reason, we acquired a state-of-the-art 3D X-Ray Machine in 2011 for 3D Computed Tomography (CT Ability), and constructed a brand new facility in Taichung in 2013. |
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| Equipment Highlights: |
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| Name |
Brand |
Model |
Function |
Q’ty |
Capacity / Character |
| Screen Printer |
TA CHEN |
TC-3040 |
Solder Paste Printer |
1 |
20 sec. / pc. |
| Auto Printe |
DEK |
ELAi |
Solder Paste Printer |
2 |
14 sec. / pc. |
| Horizon 03i |
Solder Paste Printer |
2 |
12 sec. / pc. |
| MINAMI |
MK-868SV |
Solder Paste Printer |
1 |
25 sec. / pc. |
| EKRA |
X4 |
Solder Paste Printer |
1 |
25 sec. / pc. |
| Glue Dispenser |
SANYO |
TDM-60 |
SMT Dispensing operations |
1 |
15000 points / hr. |
| Chip Mounter |
SONY |
SI-F130 |
Placement speed 0.125 sec (0.3mm Pitch 01005) |
1 |
154,000 point / hr. |
| SI-E1000 |
Placement speed 0.28 sec (0402) |
1 |
| SI-E1100 |
Placement speed 0.17 sec (0201) |
3 |
| JUKI |
KE-2070L |
Placement speed 0.155 sec (0.3mm Pitch 01005) |
2 |
| Multi-Function Mounter |
SONY |
SI-F209 |
Placement speed 0.49 sec (0.3mmPitch) |
2 |
7350 point / hr. (CHIP) |
| SI-E2100 |
Placement speed 0.60 sec (0.3mm Pitch) |
1 |
6000 point / hr. (CHIP) |
| JUKI |
KE-2060L |
Placement speed 0.28 sec (0.4mm Pitch) |
2 |
12,500 point / hr. (CHIP) |
| KE-2070L+T |
Placement speed 0.155 sec (0.3mm Pitch 01005) |
1 |
18,580 point / hr. (CHIP) |
| KE-2080L+T |
Placement speed 0.155 sec
(0.3mm Pitch 01005) |
1 |
20,900 point / hr. (CHIP) |
| Hot Air Reflow Oven |
Vitronics |
XPM2 820A |
Air Reflow |
3 |
15's / Pcs |
| MR933 |
N2 Reflow |
2 |
| Loyal Sun |
LS-16RN |
N2 Reflow |
1 |
| Automatic Optical Inspection |
TRi |
TR7501DT |
Automatic Inspection PCB |
4 |
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| BGA REWORK STATION |
DIC |
RD-500SII |
Rework BGA package Component |
1 |
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| X-Ray 3D CT |
GE |
Micromex |
2D，2.5D, CNC, CT |
1 |
0.9um |
| X-ray Fluorescent Analyzer, XRF |
SEIKO |
SEA1000A |
RoHS control substance quickly screening mechanism (Desk-Top) |
1 |
Scope: Mg12 ~ U92 |
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